Hypertec 256MB PC3200 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR2 Memory Buffered memory type Unregistered

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Module configuration 512M x 8 Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Module configuration 512M x 8 Memory clock speed 1333 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3

2 V Memory ranking 1 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 288-pin DIMM ECC No Memory clock speed 2133 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 288-pin DIMM ECC No Memory clock speed 2133 MHz Internal memory type DDR4

Hypertec 256MB PC3200 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR2 Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to